Friday, April 26, 2013


 

CALCE To Present at the IPC Electronic Systems Technologies Conference
 
 
CALCE researchers will present three studies at the upcoming IPC Electronic Systems Technology Conference (ESTC) in Las Vegas, Nevada. The first paper, "Vibration Durability of Mixed Solder Ball Grid Array Assemblies" examines the vibration durability of SAC and SnPb BGAs under harmonic vibration. This study included data for SAC305 BGAs assembled with SnPb solder and SAC105 BGAs assembled with SAC305 solder. The second paper, "Investigation of Harmonic Vibration Loading on Package on Package Assemblies," examines package-on-package (PoP) assemblies subject to harmonic vibration. In this study, the influence of the assembly process and solder composition are examined. The assembly processes was either completed with a single solder reflow or with two solder reflow process steps. Solders included SAC305, SAC125, and SAC105. Finally, Dr. Diganta Das will present his paper on “How to Improve LED Lifetime Assessment Method.” This paper will describe the IESNA standard TM-21-11, compare it with state of the art of semiconductor reliability assessment methods using physics of failure techniques.  It will show how knowledge about LED packaging and encapsulation failure mechanism can be used improve the method of reliability assessment of LEDs.  It will also show how the IESNA methodology compares with the IEEE reliability prediction framework as per IEEE 1413.
In addition to the research presentations, Dr. Michael Osterman will be conducting a professional development course at IPC Electronic Systems and Technology Conference (ESTC)on May 23, 2013, in Las Vegas, Nevada. The professional development courses provide a unique opportunity for engineers, designers, and managers to get up to date on the latest techniques and information available. At IPC ESTC, Dr. Osterman will present on "Simulation Based Reliability Assessment." This course will present failure models that can be used to assess the life expectancy of electronic equipment. Analytic and finite element modeling approaches will be presented, and case studies demonstrating the approach will be provided.
For registration and other information about IPC ESTC, please visit http://estc.ipc.org/
For information on CALCE short courses, please visit CALCE PDCs for Industry

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