CALCE To Present at the IPC Electronic Systems Technologies Conference

CALCE researchers will present three studies at the upcoming IPC Electronic Systems Technology Conference (ESTC) in Las Vegas, Nevada. The first paper, "Vibration Durability of Mixed Solder Ball Grid Array Assemblies" examines the vibration durability of SAC and SnPb BGAs under harmonic vibration. This study included data for SAC305 BGAs assembled with SnPb solder and SAC105 BGAs assembled with SAC305 solder. The second paper, "Investigation of Harmonic Vibration Loading on Package on Package Assemblies," examines package-on-package (PoP) assemblies subject to harmonic vibration. In this study, the influence of the assembly process and solder composition are examined. The assembly processes was either completed with a single solder reflow or with two solder reflow process steps. Solders included SAC305, SAC125, and SAC105. Finally, Dr. Diganta Das will present his paper on “How to Improve LED Lifetime Assessment Method.” This paper will describe the IESNA standard TM-21-11, compare it with state of the art of semiconductor reliability assessment methods using physics of failure techniques.  It will show how knowledge about LED packaging and encapsulation failure mechanism can be used improve the method of reliability assessment of LEDs.  It will also show how the IESNA methodology compares with the IEEE reliability prediction framework as per IEEE 1413. In addition to the research presentations, Dr. Michael Osterman will be conducting a professional development course at IPC Electronic Systems and Technology Conference (ESTC)on May 23, 2013, in Las Vegas, Nevada. The professional development courses provide a unique opportunity for engineers, designers, and managers to get up to date on the latest techniques and information available. At IPC ESTC, Dr. Osterman will present on "Simulation Based Reliability Assessment." This course will present failure models that can be used to assess the life expectancy of electronic equipment. Analytic and finite element modeling approaches will be presented, and case studies demonstrating the approach will be provided. For registration and other information about IPC ESTC, please visit http://estc.ipc.org/ For information on CALCE short courses, please visit CALCE PDCs for Industry

Researchers will present three studies at the upcoming IPC Conference

 

ESCS would like everyone to know that CALCE will Present at the IPC Electronic Systems Technologies Conference

CALCE researchers will present three studies at the upcoming IPC Electronic Systems Technology Conference (ESTC) in Las Vegas, Nevada. The first paper, "Vibration Durability of Mixed Solder Ball Grid Array Assemblies" examines the vibration durability of SAC and SnPb BGAs under harmonic vibration. This study included data for SAC305 BGAs assembled with SnPb solder and SAC105 BGAs assembled with SAC305 solder. The second paper, "Investigation of Harmonic Vibration Loading on Package on Package Assemblies," examines package-on-package (PoP) assemblies subject to harmonic vibration. In this study, the influence of the assembly process and solder composition are examined. The assembly processes was either completed with a single solder reflow or with two solder reflow process steps. Solders included SAC305, SAC125, and SAC105. Finally, Dr. Diganta Das will present his paper on “How to Improve LED Lifetime Assessment Method.” This paper will describe the IESNA standard TM-21-11, compare it with state of the art of semiconductor reliability assessment methods using physics of failure techniques.  It will show how knowledge about LED packaging and encapsulation failure mechanism can be used improve the method of reliability assessment of LEDs.  It will also show how the IESNA methodology compares with the IEEE reliability prediction framework as per IEEE 141

In addition to the research presentations, Dr. Michael Osterman will be conducting a professional development course at IPC Electronic Systems and Technology Conference (ESTC)on May 23, 2013, in Las Vegas, Nevada. The professional development courses provide a unique opportunity for engineers, designers, and managers to get up to date on the latest techniques and information available. At IPC ESTC, Dr. Osterman will present on "Simulation Based Reliability Assessment." This course will present failure models that can be used to assess the life expectancy of electronic equipment. Analytic and finite element modeling approaches will be presented, and case studies demonstrating the approach will be provided.
For registration and other information about IPC ESTC, please visit http://estc.ipc.org/
For information on CALCE short courses, please visit CALCE PDCs for Industry
Find this and other informative information at Electronic Supply Chain Solutions sponsored Blogs including Quality Lessons Learned

A Short Course in Failure Analysis of Electronics

When- Tuesday September 17 – Friday September 20, 2013
Venue: University of Maryland College Park, MD 20742
Electronic Supply Chain Solutions sponsors Quality Lessons Learned and provides this important  information about this program its registration, and contact info.

 Organizations involved in activities within the electronics supply chain are facing new challenges—not just from complex components and assemblies, harsher lifecycle environments, and newer materials, but also from a need for quicker turn-around. Engineers need a clear understanding of the failure mechanisms of electronic products as well as familiarity with the tools and techniques used to determine the root causes of failures.
 
Twice every year, CALCE and Buehler jointly offer a four-day course on failure analysis of electronics at the University of Maryland, College Park campus. Over 120 engineers from leading companies and government organizations from around the world, ranging from NASA to Microsoft, have taken this course. With a combination of classroom instruction, case studies, demonstrations, and hands-on laboratory training, this course covers topics ranging from failure mechanisms in electronics to specimen preparation, physics of failure, reliability, root cause analysis methodology, and materials analysis techniques.


Engaging and knowledgeable lecturers from CALCE and Buehler provide practical recommendations with numerous failure analysis case studies. The case studies illustrate the use of an array of failure analysis techniques to arrive at the root causes of field failures on printed circuit boards, passive and active components, and assemblies. Attendees will get a comprehensive picture of the variety of approaches and methods used and the rationale behind the selection of these techniques to uncover the root cause in the four cases. Each case study is concluded with recommendations for corrective actions that assist in minimizing downtime as well as prevent future occurrences of the problem.


The next course is being offered on September 17-20, 2013. Act quickly—seating is limited, so register today. Please use the attached form for registration. The course fee is $2500. A 20% discount for CALCE consortium members and federal government employees applies (final cost for CALCE consortium members and federal government employees is $2000).


Upon successful completion of this course, attendees will be awarded 1.6 Continuing Education Units (CEUs) from the University of Maryland. CEUs are an important credential for many in today’s competitive workplace.
Each attendee, once registered, is invited to submit one sample to CALCE at least three weeks before the course starts. Several of the submitted samples will be prepared and analyzed in advance for use during course demonstrations. Some of the other samples will also be used for hands-on training sessions during the course to illustrate specimen preparation procedures and analysis techniques. All unused samples will be returned. However, no guarantee can be offered that any specific sample will be used during the course.
If you have any questions or need more information contact Matt@ElectrinicSupplyChainSolutions.com
Electronic Supply Chain Solutions

Failure Analysis of Electronics Short Course

Electronic Supply Chain Solutions knows that quality of devices depends on many factors that can lead to failure. ESCS would like to share with you what we feel could be some great QUALITY LESSONS LEARNED so mark your canendar! Any questions should be directed to the contact listed below. Be quality minded and combat counterfeits with quality lessons learned from ESCS. 

 

An intensive 4-day course on “Failure Analysis of Electronics” is being offered jointly by CALCE and Buehler, on November 6-9, 2012. The course, which covers failure analysis techniques such as specimen preparation and materials analysis for electronic assemblies, components, and devices, will consist of a combination of classroom instruction, demonstrations, and hands-on laboratory training. Lecture topics include physics-of-failure-based root cause analysis, guidelines for selection of analytical tools, and practical instruction on laboratory techniques. The laboratory segment of the course includes demonstrations and step-by-step sample preparation using metallographic techniques. In addition, a number of case studies will be presented. These case studies will illustrate the step-by-step process of uncovering important pieces of information that can lead to the isolation of a failure site and root cause determination.

The course will be held at the College Park campus of the University of Maryland. Please click here (www.calce.umd.edu/facourse) or contact Bhanu Sood at 301-405-3498 or by email at bpsood@calce.umd.edu for additional details.

---

Counterfeit Electronics - Risks and Mitigation

Another Quality Lessons Learned

Two Part Webtorial, August 14 and 21, 2012

 1:00 - 2:30 pm EDT

Overview

Center for Advanced Life Cycle Engineering (CALCE) provides efficient and cost-effective failure analysis services, counterfeit parts inspection, design reviews, reliability audits, and warranty cost analysis assessment assistance for all interested parties. In the parts procurement process, the purchase of an electronic part from a part manufacturer or its authorized supplier presents very low risk. However, parts are often purchased from unauthorized sources such as independent distributors and part brokers for a variety of reasons, including part obsolescence, lead time, or unavailability of parts from authorized sources. There is a need for authentication and screening of the parts purchased from such sources to verify their authenticity. CALCE provides component authentication and screening services through its Test Services and Failure Analysis Laboratory to verify the authenticity of parts.

Topics Covered

This two-part webtorial on parts inspection and materials characterization begins with a brief primer on the diverse counterfeit electronic part creation techniques, including the recently discovered “media-blasting” method. The webtorial then discusses the effectiveness of various non-destructive techniques and destructive processing steps for inspecting suspect counterfeit components that are created using diverse techniques. The case studies illustrate the use of an array of analysis techniques to assist in determining the authenticity of an electronic part.  Inspection techniques that are discussed in the webtorial include:

·        Optical microscopy

·        X-ray microscopy

·        Acoustic microscopy, decapsulation, die inspection

·        X-ray fluorescence (XRF) spectroscopy

·        Scanning electron microscopy (SEM) / energy dispersive spectroscopy (EDS)

·        Materials characterization tools (FTIR, IC, TGA, DSC, etc.)

·        Electrical testing

Who Should Attend?

Component engineers, failure analysis engineers, reliability engineers, engineering managers, procurement managers, quality assurance personnel, contracts personnel, and anyone who is involved in policy-making activities in the fields of marketing or procurement of electronics parts and assemblies.

About the Presenter

Bhanu Sood (bpsood@calce.umd.edu) is the Director of the Test Services and Failure Analysis Laboratory at CALCE. Bhanu’s research areas at CALCE include development of analysis methodologies for component- and PCBA-level failures, materials characterization techniques for counterfeit parts identification, and investigating failure mechanisms in printed circuit boards. Prior to joining CALCE, Bhanu worked at the Naval Research Laboratory in the areas of embedded electronics, embedded batteries, and laser-assisted micro-fabrication techniques. Bhanu holds a US Patent for a laser-based technique for the transfer and embedding of electronic components and devices.

Registration

Registrations are being taken through the SMTA Online Registration System, please visit

http://www.smta.org/education/registration/event_registration.cfm?EVENT_ID=811

This post is provided by Electronic Supply Chain Solutions an AS9120 cetified franchised distributor of electronic components

Success Story in the fight to Combat Counterfeits

Electronic Supply Chain Solutions would like to inform those whom might be unaware  . . .                   

A Senate committee  meeting was  held  in Washington, DC during which Senator Levin promised a swift response to the growing problem to combat counterfeits. On November 29, 2011,  the U.S. Senate unanimously approved an amendment to the National Defense Authorization Act for Fiscal Year 2012. The legislation is supported by the bipartisan Combating Military Counterfeits Act which will ensure that increased penalties will be imposed against individuals who know that the counterfeit product they sell is intended for use by the military or is identified as a military device.

“To strengthen protections against counterfeit parts, the Levin-McCain amendment:

1. Prohibits contractors from charging the Defense Department for the cost of fixing the problem when counterfeit parts are discovered.

2. Requires the department and its contractors whenever possible to buy electronic parts from original component manufacturers and their authorized dealers or trusted suppliers who meet established standards for detecting and avoiding counterfeit parts.

3. Requires military officials and contractors who learn of counterfeit parts in the supply chain to provide written notification to the contracting officer, the Department of Defense Inspector General and to the Government-Industry Data Exchange Program.

4. Requires the Secretary of Homeland Security to establish a methodology for the enhanced inspection of electronic parts after consulting with the Secretary of Defense as to the sources of counterfeit parts in the defense supply chain.

5. Requires large defense contractors to establish systems for detecting and avoiding counterfeit parts, and authorizes reductions in contract payments to contractors who fail to do so.

6. Requires DoD to adopt policies and procedures for detecting and avoiding counterfeit parts in its direct purchases, and for assessing and acting on reports of counterfeits.

7.Adopts provisions of a bill sponsored by Sen. Sheldon Whitehouse, D-R.I., to toughen criminal sentences for counterfeiting of military goods or services.

8. Requires DoD to define the term “counterfeit part,” and at a minimum to include in that definition previously used parts represented as new.”

ESCS will monitor the follow up actions of this ammendmet and provide Quality Lessons Learned.
Contact ESCS @ 727-723-8255 for futher information.

Are you in the dark when it comes to counterfeits?

Electronic Supply Chain Solutions is working day and night to help promote awareness about ways companies can midigate the risk associated with buying counterfeit electronic components. Many people turn to our site http://www.combatcounterfeits.com/ to learn the latest "tricks they play". ESCS known for thier Professor Quality has once again found new tecnology to "Combat Counterfeits.

While working in the dark Professor Quality discovered his finger print and everyone knows there are no two alike. That is where Alp Vision's "Fingerprint "is a real breakthrough in identifying genuine manufactured objects from fake ones based on digital images of the original product stored in a secure server. Fingerprint is based on a stored image which registers unique, microscopic differences generated by the manufacturing process and the raw material used.Digital imaging software identifies these unique characteristics of the image due to intrinsic differences even though objects are produced in series. Fingerprint is a Read Only solution which simply relies on the object "as is". It therefore cannot be counterfeited.

Typical applications are authenticating genuine mechanical parts of watches, automotive spare parts, medical devices and genuine spare parts of all kinds. Bottles, cans, flasks or other conditioning with metallic or plastic parts are also concerned.

Protect moulded or stamped parts:
Protect moulded or stamped parts that are mass produced objects such as Integrated Circuits (ICs) using a mould or using stamping techniques, the same unique “signature” will be present on all the objects produced with the same mould or using the same stamping tool. Therefore if a few moulds or stamps are used, only a few reference images are necessary. Toys, game chips, automotive parts, aerospace parts, electromechanical parts, and medicinal tablets are typical Fingerprint applications.

Contact AlpVision if you need to know more or how the Fingerprint solution can be applied to your Brand Protection and Gray Market Detection of your products.

Fingerprint is a trade mark of AlpVision SA and is part of the AlpVision digital imaging security solutions.