CALCE To Present at the IPC Electronic Systems Technologies
Conference
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CALCE researchers will present three studies at the upcoming IPC
Electronic Systems Technology Conference (ESTC) in Las Vegas, Nevada. The
first paper, "Vibration Durability of Mixed Solder Ball Grid Array
Assemblies" examines the vibration durability of SAC and SnPb BGAs under
harmonic vibration. This study included data for SAC305 BGAs assembled with
SnPb solder and SAC105 BGAs assembled with SAC305 solder. The second paper,
"Investigation of Harmonic Vibration Loading on Package on Package
Assemblies," examines package-on-package (PoP) assemblies subject to
harmonic vibration. In this study, the influence of the assembly process and
solder composition are examined. The assembly processes was either completed
with a single solder reflow or with two solder reflow process steps. Solders
included SAC305, SAC125, and SAC105. Finally, Dr. Diganta Das will present his paper on “How to
Improve LED Lifetime Assessment Method.” This paper will describe the IESNA
standard TM-21-11, compare it with state of the art of semiconductor
reliability assessment methods using physics of failure techniques. It
will show how knowledge about LED packaging and encapsulation failure mechanism
can be used improve the method of reliability assessment of LEDs. It
will also show how the IESNA methodology compares with the IEEE reliability
prediction framework as per IEEE 1413.
In addition to the
research presentations, Dr. Michael Osterman will be conducting a professional
development course at IPC Electronic Systems and Technology Conference
(ESTC)on May 23, 2013, in Las Vegas, Nevada. The professional development
courses provide a unique opportunity for engineers, designers, and managers
to get up to date on the latest techniques and information available. At IPC
ESTC, Dr. Osterman will present on "Simulation Based Reliability
Assessment." This course will present failure models that can be used to
assess the life expectancy of electronic equipment. Analytic and finite
element modeling approaches will be presented, and case studies demonstrating
the approach will be provided.
For registration and other information about IPC ESTC, please
visit http://estc.ipc.org/
For information on CALCE short courses, please visit CALCE PDCs for Industry
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Friday, April 26, 2013
Researchers will present three studies at the upcoming IPC Conference
ESCS would like everyone to know that CALCE will Present at the IPC Electronic Systems Technologies Conference
CALCE researchers will present three studies at the upcoming IPC Electronic Systems Technology Conference (ESTC) in Las Vegas, Nevada. The first paper, "Vibration Durability of Mixed Solder Ball Grid Array Assemblies" examines the vibration durability of SAC and SnPb BGAs under harmonic vibration. This study included data for SAC305 BGAs assembled with SnPb solder and SAC105 BGAs assembled with SAC305 solder. The second paper, "Investigation of Harmonic Vibration Loading on Package on Package Assemblies," examines package-on-package (PoP) assemblies subject to harmonic vibration. In this study, the influence of the assembly process and solder composition are examined. The assembly processes was either completed with a single solder reflow or with two solder reflow process steps. Solders included SAC305, SAC125, and SAC105. Finally, Dr. Diganta Das will present his paper on “How to Improve LED Lifetime Assessment Method.” This paper will describe the IESNA standard TM-21-11, compare it with state of the art of semiconductor reliability assessment methods using physics of failure techniques. It will show how knowledge about LED packaging and encapsulation failure mechanism can be used improve the method of reliability assessment of LEDs. It will also show how the IESNA methodology compares with the IEEE reliability prediction framework as per IEEE 141
For registration and other information about IPC ESTC, please visit http://estc.ipc.org/
For information on CALCE short courses, please visit CALCE PDCs for Industry
Find this and other informative information at Electronic Supply Chain Solutions sponsored Blogs including Quality Lessons Learned
Tuesday, April 2, 2013
A Short Course in Failure Analysis of Electronics
When- Tuesday September 17 – Friday September 20, 2013
Venue: University of Maryland College Park, MD 20742
Electronic Supply Chain Solutions sponsors Quality Lessons Learned and provides this important information about this program its registration, and contact info.
Organizations involved in activities within the electronics supply chain are facing new challenges—not just from complex components and assemblies, harsher lifecycle environments, and newer materials, but also from a need for quicker turn-around. Engineers need a clear understanding of the failure mechanisms of electronic products as well as familiarity with the tools and techniques used to determine the root causes of failures.
Twice every year, CALCE and Buehler jointly offer a four-day course on failure analysis of electronics at the University of Maryland, College Park campus. Over 120 engineers from leading companies and government organizations from around the world, ranging from NASA to Microsoft, have taken this course. With a combination of classroom instruction, case studies, demonstrations, and hands-on laboratory training, this course covers topics ranging from failure mechanisms in electronics to specimen preparation, physics of failure, reliability, root cause analysis methodology, and materials analysis techniques.
Engaging and knowledgeable lecturers from CALCE and Buehler provide practical recommendations with numerous failure analysis case studies. The case studies illustrate the use of an array of failure analysis techniques to arrive at the root causes of field failures on printed circuit boards, passive and active components, and assemblies. Attendees will get a comprehensive picture of the variety of approaches and methods used and the rationale behind the selection of these techniques to uncover the root cause in the four cases. Each case study is concluded with recommendations for corrective actions that assist in minimizing downtime as well as prevent future occurrences of the problem.
The next course is being offered on September 17-20, 2013. Act quickly—seating is limited, so register today. Please use the attached form for registration. The course fee is $2500. A 20% discount for CALCE consortium members and federal government employees applies (final cost for CALCE consortium members and federal government employees is $2000).
Upon successful completion of this course, attendees will be awarded 1.6 Continuing Education Units (CEUs) from the University of Maryland. CEUs are an important credential for many in today’s competitive workplace.
Each attendee, once registered, is invited to submit one sample to CALCE at least three weeks before the course starts. Several of the submitted samples will be prepared and analyzed in advance for use during course demonstrations. Some of the other samples will also be used for hands-on training sessions during the course to illustrate specimen preparation procedures and analysis techniques. All unused samples will be returned. However, no guarantee can be offered that any specific sample will be used during the course.
If you have any questions or need more information contact Matt@ElectrinicSupplyChainSolutions.com
Electronic Supply Chain Solutions
Venue: University of Maryland College Park, MD 20742
Electronic Supply Chain Solutions sponsors Quality Lessons Learned and provides this important information about this program its registration, and contact info.
Organizations involved in activities within the electronics supply chain are facing new challenges—not just from complex components and assemblies, harsher lifecycle environments, and newer materials, but also from a need for quicker turn-around. Engineers need a clear understanding of the failure mechanisms of electronic products as well as familiarity with the tools and techniques used to determine the root causes of failures.
Twice every year, CALCE and Buehler jointly offer a four-day course on failure analysis of electronics at the University of Maryland, College Park campus. Over 120 engineers from leading companies and government organizations from around the world, ranging from NASA to Microsoft, have taken this course. With a combination of classroom instruction, case studies, demonstrations, and hands-on laboratory training, this course covers topics ranging from failure mechanisms in electronics to specimen preparation, physics of failure, reliability, root cause analysis methodology, and materials analysis techniques.
Engaging and knowledgeable lecturers from CALCE and Buehler provide practical recommendations with numerous failure analysis case studies. The case studies illustrate the use of an array of failure analysis techniques to arrive at the root causes of field failures on printed circuit boards, passive and active components, and assemblies. Attendees will get a comprehensive picture of the variety of approaches and methods used and the rationale behind the selection of these techniques to uncover the root cause in the four cases. Each case study is concluded with recommendations for corrective actions that assist in minimizing downtime as well as prevent future occurrences of the problem.
The next course is being offered on September 17-20, 2013. Act quickly—seating is limited, so register today. Please use the attached form for registration. The course fee is $2500. A 20% discount for CALCE consortium members and federal government employees applies (final cost for CALCE consortium members and federal government employees is $2000).
Upon successful completion of this course, attendees will be awarded 1.6 Continuing Education Units (CEUs) from the University of Maryland. CEUs are an important credential for many in today’s competitive workplace.
Each attendee, once registered, is invited to submit one sample to CALCE at least three weeks before the course starts. Several of the submitted samples will be prepared and analyzed in advance for use during course demonstrations. Some of the other samples will also be used for hands-on training sessions during the course to illustrate specimen preparation procedures and analysis techniques. All unused samples will be returned. However, no guarantee can be offered that any specific sample will be used during the course.
If you have any questions or need more information contact Matt@ElectrinicSupplyChainSolutions.com
Electronic Supply Chain Solutions
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